Manufacturing Steps

Inside BEOK's Thermostat Manufacturing Process – Precision at Every Step

 

Every BEOK CONTROLS thermostat represents a journey of precision engineering, rigorous testing, and unwavering quality control. Our manufacturing process transforms raw materials into intelligent temperature control solutions trusted by customers in over 120 countries. Here's a detailed look at how we build excellence into every product.

 

Stage 1: Incoming Quality Control (ICQ)

Before any component enters our production line, it must pass rigorous incoming inspection.

Step	Operation Details	Inspection Standard
1. Material Receiving	Verify purchase orders, confirm material model, quantity, and batch number	Match BOM exactly
2. Electronic Component Inspection	Resistors/capacitors/chips: verify specifications (resistance, capacitance, voltage rating); Sensors: test sensitivity (output signal at 25°C); PCBs: no warping, short circuits, or pad oxidation	Component defect rate ≤0
3. Structural Part Inspection	Enclosures (ABS material): no burrs, color difference, or deformation; Buttons: consistent rebound force; Screws: correct specifications, no thread damage	Dimensional tolerance ±0.2mm
4. Qualified Warehousing	Affix "PASS" labels to qualified materials; store separately (ESD area for electronics, moisture-proof area for structural parts)	FIFO (First-In-First-Out)

 

Stage 2: Core Component Processing

This stage transforms raw PCBs and components into functional circuit board assemblies through SMT, DIP, and pre-assembly processes.

2.1 PCB SMT (Surface Mount Technology) Process

Step	Operation Details	Standard/Control Point
1. PCB Pre-treatment	Clean PCB surface of oil, dust, and oxidation layer	ESD dust removal equipment, alcohol wipe
2. Solder Paste Printing	Position stencil, print solder paste onto PCB pads	Solder paste thickness: 0.15-0.2mm; no missing or bridging
3. Component Placement	Use pick-and-place machine to precisely mount chips, resistors, capacitors, sensors, etc. onto pads	Placement accuracy: ±0.05mm; no misalignment or missing components
4. Reflow Soldering	Pass PCB through reflow oven following temperature profile: Pre-heat (80-120°C) → Soak (150-170°C) → Reflow (230-250°C) → Cooling	No cold joints, false soldering, or solder bridging
5. SMT First-Article Inspection	Inspect first PCB with AOI; proceed to mass production only after approval	First-article sign-off; random sampling every hour thereafter
6. Rework	Manually rework defective boards with soldering iron; touch up or replace components	ESD wrist strap required; re-inspect after rework
7. QC Inspection	Passed boards go to ESD-safe storage	PCBA must be placed on ESD racks or in ESD bins

 

2.2 DIP (Dual In-line Package) Soldering Process

 

2.3 Panel PCB Pre-Processing